Cooling setup considerationsīefore thinking about overhauling your cooling setup or assembling components for a new build, here are some considerations to keep in mind. That is, you cannot add additional tubing and parts to expand the loop.Ī bare Peltier element. These are not user serviceable beyond installation and basic maintenance. This is a self-contained unit that includes the heat block, a pump, and a radiator. Types of Liquid Cooling Closed-loop system (aka all-in-one) They can also be used to help bleed air out of the system.
Air coolers also requires a lot more airflow, which translates to more noise, to achieve the same operating temperature as other cooling methods.
However, better air-cooling solutions can get bulky and heavy. This is the most basic method of cooling, and costs the least. Cooler air picks up the heat from a component and either airflow from case fans or natural convection (as heat rises) carries the hot air away. Air CoolingĪn air-cooling solution that consists of a heatsink, heat pipes, and a fan.Īir cooling uses the case’s air as the primary cooling medium. Each differ by what kind of physics magic they employ to do so. There are several ways to cool off hot components in your rig. Heat may cause performance degradation, but by way of the component throttling itself to prevent it from getting hotter. Otherwise, heat doesn’t affect anything else to a noticeable degree. This causes more current to flow through the device, which causes it to get even hotter, until the chip burns up. While the resistance of a semiconductor increases, at around 160° C, its resistance decreases. Thermal stress is much more prominent if the temperature differences are wide.Īn interesting characteristic of semiconductor electronics is that it can exhibit thermal runaway.
At some point, the material cracks and breaks. Repeated heating/cooling cycles cause mechanical stress that can fatigue the material. When things get hot, they expand when they cool off, they contract. If reliability issues start cropping up (due to, e.g., overclocking a processor very high and constantly running heavy loads), running the part at a lower performance level may eke out a bit more life before the system is no longer reliable.Īnother effect that heat has on components is thermal stress. The reliability loss however, affects how stable the part is at a given performance level. Over time, high heat accelerates wear and decreases reliability of the components. Physics just allows both forms of energy to be measured in watts. TDP is for heat energy, not electrical energy. TDP is not the same as power consumption.
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